Directional deposition of Cu into semiconductor trench structures using ionized magnetron sputtering
نویسندگان
چکیده
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Accelerated bacterial inactivation obtained by HIPIMS sputtering on low cost surfaces with concomitant reduction in the metal/semiconductor content3 DOI: 10.1039/c3ra41528g www.rsc.org/advances
Novel ultrathin TiO2–Cu nanoparticulate films sputtered by highly ionized pulsed plasma magnetron sputtering (HIPIMS) lead to faster bacterial inactivation compared to more traditional sputtering approaches with an appreciable metal saving. HIPIMS sputtering induces a strong interaction of the TiO2–Cu-ions (M ) with the polyester surface due to the high fraction and density of M-ions interactin...
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